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1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 1x19 1.27mm single row style1 pin1 left Surface mounted pin header THT 1x07 2.54mm single row Surface mounted pin header THT 1x07 2.00mm single row Through hole socket strip THT 1x06 2.54mm single row Through hole angled pin header, 1x14, 1.27mm pitch, 4.0mm pin length, single row style1 pin1 left Surface mounted socket strip SMD 2x29 2.54mm double row Through hole angled socket strip THT 1x30 2.54mm single row style2 pin1 right Through hole straight socket strip, 2x06, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x23 2.00mm single row.

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