Labels Milestones
BackBump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole straight socket strip, 1x27, 2.54mm pitch, 8.51mm socket length, single row Through hole socket strip SMD 1x04 2.54mm single row Through hole straight pin header, 1x18, 2.00mm pitch, 4.2mm pin length, double rows Through hole angled pin header, 2x16, 1.27mm pitch, double rows Surface mounted socket strip SMD 1x29 1.00mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole angled pin header, 1x20, 1.00mm pitch, 2.0mm pin length, single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x25 1.00mm single row Through hole pin header THT 2x39 1.00mm double row Through.