synth_tools

Back

FFV676 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, Analog Devices KS-4, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sc70ks/ks_4.pdf Analog Devices KS-4, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sc70ks/ks_4.pdf Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments LM25119 http://www.ti.com/lit/ds/symlink/lm25119.pdf WQFN, 42 Pin https://content.u-blox.com/sites/default/files/NINA-B1_DataSheet_UBX-15019243.pdf#page=30 NINA ublox u-blox b111 bluetooth nrf52840 module Omron Relay, DPDT, https://omronfs.omron.com/en_US/ecb/products/pdf/en-g2rl.pdf Omron Relay, DPDT, https://omronfs.omron.com/en_US/ecb/products/pdf/en-g2rl.pdf Omron G5V-2 Relay DPDT FRT5 narrow footprint Finder 32.21-x000 Relay, SPDT, High Capacity, https://omronfs.omron.com/en_US/ecb/products/pdf/en-g2rl.pdf Omron Relay, SPDT, High Capacity, https://omronfs.omron.com/en_US/ecb/products/pdf/en-g2rl.pdf Omron G5V-2 Relay DPDT Finder 40.52, Pitch 5mm/7.5mm, https://www.finder-relais.net/de/finder-relais-serie-40.pdf Relay DPDT Schrack-RT2 RM5mm 16A 250V AC Form A Standex-Meder MS SIL-relais, Form 1A/1B, see https://standexelectronics.com/de/produkte/ms-reed-relais/ Standex Meder DIP reed relay series, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_DIP.pdf DIL DIP PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon PLCC, 20 pins, single row style2 pin1 right Through hole horizontal IDC header THT 1x10 1.00mm single row style2 pin1 right Through hole pin header SMD 1x18 1.27mm single row style2 pin1 right Through hole angled socket strip SMD 1x23 2.00mm single row Through hole angled socket strip, 2x22, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 3.81mm post length, 1x02, 5.08mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x05, 2.00mm pitch, double rows Through hole Samtec HPM power header series 3.81mm post length, 1x10, 5.08mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x13 1.00mm single row style2 pin1 right Through hole pin header THT 1x39 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x32 2.54mm single row Through hole angled socket strip SMD 2x12 2.00mm double row Through hole straight socket strip, 2x16, 2.00mm pitch, 4.2mm pin length, single row style1 pin1 left Surface mounted socket strip SMD Solder 3-pad Jumper, 1x1.5mm Triangular Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip, labeled with numbers SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, open, labeled with numbers SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open, labeled.

New Pull Request

Labels Milestones