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HTSOP package with missing pin 5, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 24.13 mm (950 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil 8-lead dip package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 32-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 16.51mm 650mil SMDSocket LongPads 24-lead though-hole mounted DIP package, row spacing 6.15.

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