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0.8 CS325 CSG235 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l052t8.pdf WLCSP-36, 6x6 raster, 2.553x2.579mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32f042k6.pdf WLCSP-36, 6x6 raster, 2.5x2.5mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f401vc.pdf WLCSP-49, 7x7 raster, 2.999x3.185mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f401vc.pdf WLCSP-49, 7x7 raster, 3.89x3.74mm package, pitch 0.4mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf WLCSP-144, 12x12 raster, 10x10mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments EUS 5 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket 64-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 3x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket LongPads 22-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 1x-dip-switch SPST Copal_CVS-01xB, Slide, row spacing 7.62 mm (300 mils), body size 10.8x21.88mm 8x-dip-switch SPST Copal_CHS-08B, Slide, row spacing 8.9 mm (350 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 24.13mm 950mil SMDSocket LongPads 28-lead though-hole mounted DIP package, row spacing.

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