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BackS-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf 3x3mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Through hole angled pin header SMD 1x09 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x14, 2.54mm pitch, single row Through hole straight pin header, 2x34, 1.27mm pitch, 4.0mm pin length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight pin header, 2x07, 2.54mm pitch, single row Surface mounted pin header THT 1x13 5.08mm single row Through hole Samtec HPM power header series 11.94mm post length, 1x17, 5.08mm pitch, single row Through hole straight socket strip, 2x02, 2.54mm pitch, 8.51mm socket length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled socket strip, 1x38, 1.27mm pitch, 4.0mm pin length, single.
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