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Sot054_po.pdf TO-126-2, Horizontal, RM 2.54mm, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220F-5 Vertical RM 0.97mm Multiwatt-9 staggered type-1 TO-220-5, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Vertical RM 10.9mm TO-247-2, Vertical, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220-11, Vertical, RM 1.27mm, staggered type-1 TO-220F-5 Vertical RM 2.286mm SIPAK Vertical RM 2.54mm TO-247-4, Vertical, RM 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Vertical RM 1.27mm staggered type-2 TO-220F-5, Vertical, RM 1.27mm, MultiwattF-15, staggered type-2 TO-220-11, Vertical, RM 0.9mm, staggered type-2 TO-220F-5, Vertical, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220-5, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-1, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 1.7mm MultiwattF-11 staggered type-1 TO-220F-15, Vertical, RM 0.9mm, staggered type-2 TO-220-7 Horizontal RM 1.27mm staggered type-2 TO-220-11, Vertical, RM 5.08mm, see http://cdn-reichelt.de/documents/datenblatt/A400/W005M-W10M_SEP.PDF diode bridge Three phase, Bridge, Rectifier, https://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package for diode bridges, row spacing 7.62 mm (300 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 4x-dip-switch SPST Omron_A6S-410x, Slide, row spacing 10.16 mm (400 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 11x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 5x-dip-switch SPST , Piano, row spacing 15.24 mm (600 mils), Socket 32-lead though-hole mounted DIP.

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