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SMD 1x15 1.27mm single row Through hole angled socket strip, 1x27, 2.00mm pitch, 4.2mm pin length, single row style1 pin1 left Surface mounted pin header SMD 1x03 2.54mm single row Surface mounted pin header SMD 1x28 1.00mm single row style1 pin1 left Surface mounted pin header SMD 1x08 2.00mm single row Through hole pin header THT 2x40 2.54mm double row Through hole IDC header, 2x05, 2.00mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole pin header SMD 1x15 1.00mm single row style1 pin1 left Surface mounted socket strip THT 2x24 2.00mm double row Through hole straight pin header, 2x35, 2.54mm pitch, double rows Through hole straight pin header, 2x28, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole horizontal IDC header THT 1x06 1.27mm single row Through hole angled pin header SMD 2x12 1.00mm double row surface-mounted straight socket strip, 2x32, 2.00mm pitch, 6.35mm socket length, double rows Surface mounted socket strip THT 1x05 2.00mm single row Surface mounted socket strip THT 1x33 1.27mm single row (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x16 1.27mm single row style1 pin1 left Surface mounted pin header SMD 2x03 1.27mm double row Molex LY 20 series connector, B16B-J21DK-GGXR (http://www.jst-mfg.com/product/pdf/eng/eJFA-J2000.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 3, Wuerth electronics 9774045243 (https://katalog.we-online.de/em/datasheet/9774045243.pdf), generated with kicad-footprint-generator Molex LSHM 0.50 mm Razor Beam High-Speed Hermaphroditic Terminal/Socket Strip, LSHM-110-xx.x-x-DV-S, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Pin Plastic Quad Flat, No Lead Package - 3x3 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad HTSSOP32: plastic thin shrink small outline package; 44 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 48 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf HTSSOP, 38 Pin (JEDEC MO-153 Var JA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator connector JST PH series connector, S02B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 2.5 mm² wires, basic insulation.

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