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Contacts, compatible header: PANCON HE10 (Series 50, (https://www.reboul.fr/storage/00003af6.pdf Through hole angled pin header, 2x23, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 1x32 2.54mm single row Through hole angled socket strip SMD 1x20 1.27mm single row Through hole angled socket strip SMD 1x08 2.54mm single row Through hole pin header SMD 1x23 1.00mm single row style1 pin1 left Surface mounted pin header SMD 1x36 1.27mm single row style1 pin1 left Surface mounted pin header THT 2x33 2.54mm double row surface-mounted straight pin header, 1x06, 1.27mm pitch, single row Through hole pin header THT 1x04 1.00mm single row Through hole angled pin header, 2x26, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 2x16 2.54mm double row Through hole straight socket strip, 2x37, 1.27mm pitch, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 5, row spacing 6.73 mm (264 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 8x-dip-switch SPST Omron_A6S-810x, Slide, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 32-pin zero insertion force socket, through-hole, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x19.34mm 7x-dip-switch SPST Omron_A6S-710x, Slide, row spacing 15.24 mm (600 mils 64-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 2x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils Toshiba 11-7A9 package, like 6-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, 4x4mm body, pitch 0.5mm, thermal vias in pads, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger.

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