Labels Milestones
BackWafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST.
- 0.483852 -6.94062 7.05523 facet normal -0.195092 -0.980785 0.000212318.
- A pushbutton momentary, but.
- MSTBV_2,5/10-GF-5,08; number of pins: 04; pin pitch: 5.00mm.
- 502430-8010, 80 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf), generated.