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3.029x3.029mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l031f6.pdf WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf WLCSP-64, 8x8 raster, 3.347x3.585mm package, pitch 0.5mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f301r8.pdf WLCSP-49, 7x7 raster, 2.965x2.965mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/dac80508.pdf Analog LFCSP, 16 Pin package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header SMD 1x33 2.00mm single row Through hole angled pin header, 2x15, 1.00mm pitch, single row Through hole straight Samtec HPM power header series 3.81mm post length THT 1x06 2.54mm single row Through hole angled socket strip, 2x24, 2.00mm pitch, single row style2 pin1 right Through hole angled pin header, 2x05, 2.54mm pitch, 6mm pin length, single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x17, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip.

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