Labels Milestones
BackCopper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes.
- BT.ttf From 0c682bad950fdd2cbbdce033cf243faec76364d8 Mon Sep 17 00:00:00 2001.
- Enter, PCB mount, retention.
- SMDPad 1mmx2mm ACDC-Converter, 10W, HiLink, HLK-10Mxx, THT.
- 4mm Electrolytic Capacitor CP, Radial.