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(6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x34, 1.00mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole straight pin header, 2x29, 1.27mm pitch, 4.0mm pin length, double rows Through hole socket strip THT 1x13 5.08mm single row Surface mounted pin header THT 1x34 2.00mm single row style2 pin1 right Through hole socket strip THT 2x09 1.27mm double row Through hole angled socket strip, 2x10, 2.00mm pitch, double rows Through hole straight pin header, 1x24, 2.54mm pitch, DIN 41651 / IEC 60603-13.

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