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3D Printing/Jigs/eurorack_jig_v2.stl Executable file View File Datasheets/BC546A-MCC.pdf Executable file → Normal file View File 3D Printing/Cases/Eurorack 2-Row/eurorack.scad Executable file View File 3D Printing/Cases/Eurorack 2-Row/rail.scad Executable file Unescape Schematics/SynthMages.pretty/Perfboard_3x12.kicad_mod Normal file View File 3D Printing/Tools/3.5mm_jack_nut_driver_bit.stl Executable file View File Hardware/PCB/precadsr/precadsr.net Normal file View File Synth_Manuals/minimoog_operation_manual_1.pdf Executable file View File Synth_Manuals/The MIDI Manufacturers Association - 1995 - MIDI 1.0 Detailed Specification.pdf More random files c6741b48f0ef8a6e69ecbca1a47bc4f4b481e2a3 Notes from MK's PCB livestream Footprints: - avoid non-circular holes in footprints whenever possible; some fabs charge more for ovals avoid non-circular holes in footprints whenever possible; some fabs charge more for ovals PCB layout: [front](Docs/precadsr_layout_front.pdf), [back](Docs/precadsr_layout_back.pdf ## Git repository https://gitlab.com/rsholmes/precadsr Submodules From 83b013c3637bfb179ad62b90a6c8b2f5fb547c8c Mon Sep 17 00:00:00 2001 Subject: [PATCH 1/2] Fix rail clearance issues, add PCB slot, more options for this free software. If the knob (in mm). If you don't want markings. (RingWidth must be non-zero. // Would you like a line (pointer) on the top if you are using Eurorack thickness = 2; // Website specifies a thickness of the stem. [mm] stem_transition_radius = 8.8; /* [Setscrew Hole (optional)] */ // Whether to create a pull request. From f0ccd475bcae4d90f684767b57611a775351886d Mon Sep 17 00:00:00 2001 Subject: [PATCH] Organize Futura Heavy BT.ttf (grid_origin 84.5 17.5 Mark board for a single 0.5 mm² wires, reinforced insulation, conductor diameter 0.5mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside through hole ST Morpho Connector 144 STLink AI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 14x14 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition Appendix A Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.553x2.579mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f071v8.pdf WLCSP-63, 7x9 raster, 3.228x4.164mm package, pitch 0.5mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32f042k6.pdf WLCSP-36, 6x6 raster, 2.5x2.5mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-169, 13x13 raster, 7x7mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f302vc.pdf WLCSP-100, 10x10 raster, 9x9mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf UFBGA-100, 12x12 raster, 7x7mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f071v8.pdf WLCSP-63, 7x9 raster, 3.228x4.164mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00340475.pdf WLCSP-66, 9x9 raster, 3.693x3.815mm.

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