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Https://suddendocs.samtec.com/prints/t1m-single-row-footprint.pdf conn samtec card-edge socket high-speed 0.8 mm Highspeed card edge connector for 2.4mm PCB's with 05 contacts (not polarized Highspeed card edge connector for PCB's with 30 contacts (polarized Highspeed card edge connector for PCB's with 40 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 05 contacts (polarized Highspeed card edge card connector socket for 2.36mm PCBs, vertical (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA.

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