Labels Milestones
BackPackage; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 28 leads; body width 4.4 mm; Exposed Pad Variation BB; (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias HTSSOP, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc8246.pdf#page=263), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 6, Wuerth electronics 9771100360 (https://katalog.we-online.com/em/datasheet/9771100360.pdf), generated with kicad-footprint-generator Hirose series connector, SM08B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 10, Wuerth electronics 9776050960 (https://katalog.we-online.com/em/datasheet/9776050960.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 7, Wuerth electronics 97730506330 (https://katalog.we-online.com/em/datasheet/97730506330.pdf), generated.
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