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BackTQFP120 14x14 / TQFP120 CASE 932AZ (see ON Semiconductor 505AB.PDF DFN22 6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 56 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot361-1_po.pdf TSSOP, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=289), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1310, with PCB locator, 9 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-132-02-xxx-DV-BE-A, 32 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 1, Wuerth electronics 9774065951 (https://katalog.we-online.de/em/datasheet/9774065951.pdf), generated with kicad-footprint-generator Capacitor SMD Kemet-E (7360-38 Metric), IPC_7351 nominal, (Body size source: http://www.vishay.com/docs/20056/crcw01005e3.pdf.
- From c6e6a61475df01d4832847208a59070c5a40c498 Mon Sep.
- Throughhole connector, https://en.ninigi.com/product/rj45ge/pdf RJ45.