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Coil SMD, Murata DLW5BTxxxSQ2x, https://www.murata.com/products/productdata/8796762701854/EFLC0020.pdf, manual footprint inductor common mode choke WE-CNSW SMT Common Mode Choke, https://www.coilcraft.com/pdfs/0603usb.pdf surface mount PLCC, 68 pins, through hole 3.2mm, height 4.6, Wuerth electronics 9774080982 (https://katalog.we-online.de/em/datasheet/9774080982.pdf), generated with kicad-footprint-generator JST PHD series connector, SM12B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 8 Pin (https://docs.broadcom.com/docs/AV02-4755EN), generated with kicad-footprint-generator Soldered wire connection, for 2 times 2.5 mm² wire, reinforced insulation, conductor diameter 0.48mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex PicoBlade series connector, B2P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, SM15B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq25601.pdf#page=54), generated with kicad-footprint-generator ipc_noLead_generator.py 32-Lead Frame Chip Scale Package - 3x3 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf DFN, 6 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5353.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: A-41791-0012 example for new part number: A-41792-0008 example for new part number: AE-6410-02A example for new mpn: 39-29-4189, 9 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator JST XA series connector, 14110713002xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13002XXX_100228421DRW035C.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Hirose DF13 through hole, DF13-04P-1.25DSA, 4 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 80, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias HTSSOP, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=332), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-32DS-0.5V, 32 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4130, 13 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP24: plastic shrink small outline package; 56 leads; body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf HTSSOP, 38 Pin (JEDEC MO-153 Var BE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4180, 18 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py EQFP, 144 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425), generated with kicad-footprint-generator Mounting Hardware, inside through hole THT Kemet EC2 signal relay DPDT non single coil latching surface mount common mode choke 1206 cnsw Inductor, Eaton, MCL2012V1, 2.0x1.2x0.9mm, https://eu.mouser.com/datasheet/2/87/eaton-mcl2012v1-multilayer-chip-inductor-data-shee-1622891.pdf Inductor ferrite multilayer power Ferrocore DLG-0302.

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