Labels Milestones
Back1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUS 5 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils THT DIP DIL PDIP SMDIP 2.54mm 11.48mm 451mil 6-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket 64-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils THT DIP DIL PDIP SMDIP 2.54mm 25.24mm 993mil 42-lead surface-mounted (SMD) DIP package, row spacing 5.08 mm (200 mils), body size 10.8x26.96mm 10x-dip-switch SPST KingTek_DSHP10TS, Slide, row spacing 11.48 mm (451 mils.
- Itrip=20.0A, http://www.bourns.com/docs/product-datasheets/mfrht.pdf PTC Resettable Fuse, Ihold.
- -4.533736e-002 9.989718e-001 0.000000e+000 vertex.