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Connector, DF3EA-08P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing&lang=en&documentid=0001163317), generated with kicad-footprint-generator Hirose DF13C SMD, CL535-0404-8-51, 4 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 24 Pin (http://www.ti.com/lit/ds/symlink/lm26480.pdf#page=39), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-119-02-xxx-DV-BE-A, 19 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-106-02-xx-DV-TE, 6 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4060, 6 Pins (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=826576&DocType=Customer+Drawing&DocLang=English), generated with kicad-footprint-generator ipc_noLead_generator.py MLPQ 32 leads, 7x7mm, 0.127mm stencil (https://www.infineon.com/dgdl/Infineon-AN1170-AN-v05_00-EN.pdf?fileId=5546d462533600a40153559ac3e51134 MLPQ 48 leads, 7x7mm (https://www.infineon.com/dgdl/irs2093mpbf.pdf?fileId=5546d462533600a401535675fb892793 MLPQ 48 leads, 7x7mm (https://www.infineon.com/dgdl/irs2093mpbf.pdf?fileId=5546d462533600a401535675fb892793 MLPQ 48 leads, 7x7mm (https://www.infineon.com/dgdl/irs2052mpbf.pdf?fileId=5546d462533600a401535675d3b32788 PQFN 22 leads, 5x6mm, 0.127mm stencil (https://www.infineon.com/dgdl/ir4302.pdf?fileId=5546d462533600a4015355d602a9181d, https://www.infineon.com/dgdl/Infineon-AN1170-AN-v05_00-EN.pdf?fileId=5546d462533600a40153559ac3e51134 14-Lead Plastic Dual Flat, No Lead Package (8E) - 4x4x0.9 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 48 pin, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YZT, 1.86x1.36mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments CSD18531Q5A http://www.ti.com/lit/ds/symlink/csd18531q5a.pdf WSON, 6 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5353.pdf), generated with kicad-footprint-generator JST PH series connector, S2B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5566-20A, example for new mpn: 39-28-x18x, 9 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator.

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