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7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic DFN (2mm x 2mm) 0.40mm pitch DDB Package; 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [HTSSOP], with thermal vias in pads, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-0820, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Net tie, 3 pin, 2.0mm square SMD pads Net tie, 2 pin, 1.0mm round THT pads Net tie, 2 pin, 0.3mm round THT pads Net tie, 2 pin, 0.3mm round THT pads Net tie, 3 pin, 0.5mm square SMD.

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