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BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled socket strip SMD 2x33 2.54mm double row Through hole angled socket strip, 1x16, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x40 2.54mm double row Through hole angled socket strip, 2x39, 2.00mm pitch, single row (from Kicad 4.0.7), script generated Through hole pin header THT 1x22 2.54mm single row Through hole pin header THT 2x13 2.00mm double row Through hole socket strip THT 2x37 2.54mm double row surface-mounted straight pin header, 1x21, 2.54mm pitch, https://www.raspberrypi.org/documentation/hardware/raspberrypi/mechanical/rpi_MECH_Zero_1p2.pdf raspberry pi zero through hole 3.2mm, height 4.6, Wuerth electronics 9776070960 (https://katalog.we-online.com/em/datasheet/9776070960.pdf), generated with kicad-footprint-generator Soldered wire connection, for 2 times 0.75 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 1.7mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Resistor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with.

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