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16-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 2.54mm 15.24mm 600mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row.

• 804-103 45Degree pitch 7.5mm size.
• TO-92S_Wide package, drill 0.75mm (see NXP.
• Capacitor" (description "Schottky diode" update=Sat 28.

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