synth_tools

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2x14, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x40, 1.00mm pitch, double rows Surface mounted socket strip THT 1x03 2.00mm single row Surface mounted pin header SMD 1x26 2.00mm single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x25, 1.00mm pitch, 2.0mm pin length, single row style1 pin1 left Surface mounted socket strip THT 1x39 2.00mm single row style1 pin1 left Surface mounted socket strip THT 2x30 2.54mm double row Through hole IDC header, 2x17, 2.54mm pitch, single row style2 pin1 right Through hole angled socket strip, 2x38, 2.00mm pitch, 6.35mm socket length, single row style2 pin1 right Through hole angled pin header THT 2x36 2.54mm double row Through hole angled pin header, 1x29, 2.00mm pitch, double rows Through hole angled pin header THT 2x21 2.00mm double row surface-mounted straight socket strip, 2x13, 2.54mm pitch, 6mm pin length, single row Surface mounted socket strip THT 2x12 2.54mm double row surface-mounted straight pin header, 2x04, 1.00mm pitch, single row Surface mounted socket strip SMD 1x05 2.00mm single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x15, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 10x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 4x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil LongPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil 24-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 4x-dip-switch SPST Omron_A6H-4101, Slide, row spacing 8.61 mm (338 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 4x-dip-switch SPST Omron_A6H-4101, Slide, row spacing 15.24 mm (600 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils SMD DIP DIL PDIP 2.54mm 25.4mm 1000mil LongPads 40-lead though-hole mounted DIP package, row spacing 9.53.

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