Labels Milestones
Back7.7 of http://www.st.com/resource/en/datasheet/DM00330506.pdf WLCSP-100, 10x10 raster, 4.775x5.041mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments.
- Hole as test point, loop diameter 3.8mm.
- SWPA8040S, 8.0x8.0x4.2mm, https://www.sunlordinc.com/UploadFiles/PDF_Cat/20120704094224784.pdf Inductor, Sunlord, SWPA4018S, 4.0x4.0x1.8mm, https://www.sunlordinc.com/UploadFiles/PDF_Cat/20120704094224784.pdf.