3
1
Back

(http://ww1.microchip.com/downloads/en/DeviceDoc/40001800C.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1030, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation AA), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 64 Pin (https://datasheet.lcsc.com/szlcsc/Realtek-Semicon-RTL8211EG-VB-CG_C69264.pdf#page=77), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 16 Pin (http://www.ti.com/lit/ds/symlink/cdclvp1102.pdf#page=28), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-1410.

New Pull Request