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Of 8-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 10.8x32.04mm 12x-dip-switch SPST CTS_Series194-12MSTN, Piano, row spacing 10.16 mm (400 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD DIP DIL PDIP 2.54mm 7.62mm 300mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x30.12mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 8x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 12x-dip-switch SPST CTS_Series194-12MSTN, Piano, row spacing 7.62 mm (300 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Vertical RM 5.45mm TO-3PB-3, Horizontal, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Horizontal RM 0.97mm Multiwatt-9 staggered type-1 TO-220-7 Horizontal RM 2.286mm SIPAK Vertical RM 2.54mm TO-220-4, Vertical, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Vertical RM 2.54mm staggered type-2 TO-220-4 Horizontal RM 2.54mm TO-220-3, Vertical, RM 0.9mm, staggered type-2 TO-220-4 Vertical RM 1.27mm.

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