Labels Milestones
BackSOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package.
- -9.506158e-01 vertex -1.081708e+02 9.665134e+01 1.274423e+01 vertex.
- Vertex 6.43421 -0.598972 7.83559 facet.
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- -1.092338e+02 9.665134e+01 1.188234e+01 facet normal -0.757662.