3
1
Back

DSBGA, 1.36x1.86mm, 12 bump 3x4 (area) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x08, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x10 2.54mm single row Through hole straight socket strip, 1x36, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled pin header, 2x38, 2.00mm.

New Pull Request