Labels Milestones
BackHttps://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Horizontal RM 1.7mm staggered type-1 TO-220-4, Horizontal, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-2 Vertical RM 2.54mm staggered type-2 TO-220F-7, Vertical, RM 1.7mm, IIPAK, I2PAK, see http://pdf.datasheetcatalog.com/datasheet/irf/iris4011.pdf TO-262-5 Horizontal RM 1.7mm staggered type-2 TO-220-7 Horizontal RM 5.08mm TO-220F-2, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Horizontal RM 5.45mm TO-46-2, Pin2 at center of package, Thorlabs photodiodes, https://www.thorlabs.de/drawings/374b6862eb3b5a04-9360B5F6-5056-2306-D912111C06C3F830/FDGA05-SpecSheet.pdf TO-92 leads in-line, narrow, oval pads, drill 0.75mm (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf TO-92L Inline Wide transistor TO-92Mini package, drill 0.75mm (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 temperature sensor diode TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf TO-92L Inline Wide transistor TO-92L Molded Narrow transistor TO-92L leads in-line (large body variant of 8-lead surface-mounted (SMD) DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads 14-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 10x10mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf WLCSP-64, 8x8 raster, 3.141x3.127mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm.
- S32B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py.
- Normal 2.806318e-02 -9.996061e-01 3.536535e-04.