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THT DS15 5.0mm length 1.5mm diameter http://www.microcrystal.com/images/_Product-Documentation/03_TF_metal_Packages/01_Datasheet/DS-Series.pdf Crystal THT HC-33/U, http://pdi.bentech-taiwan.com/PDI/GEN20SPEV20HC3320U.pdf Crystal, Quarz, HC35/U, http://www.kvg-gmbh.de/assets/uploads/files/product_pdfs/TO71xx.pdf Crystal THT HC-51/U, http://www.crovencrystals.com/croven_pdf/HC-51_Crystal_Holder_Rev_00.pdf Crystal THT DS10 4.3mm length 1.0mm diameter http://www.microcrystal.com/images/_Product-Documentation/03_TF_metal_Packages/01_Datasheet/DS-Series.pdf SMD Crystal Oscillator Seiko Epson SG-8002CA https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, hand-soldering, 10.5x5.0mm^2 package SMD Crystal SERIES SMD7050/4 https://www.foxonline.com/pdfs/FQ7050.pdf, hand-soldering, 7.0x5.0mm^2 package Miniature Crystal Clock Oscillator IQXO-70, http://www.iqdfrequencyproducts.com/products/details/iqxo-70-11-30.pdf, 7.5x5.0mm^2 package crystal Epson Toyocom TSX-3225 series https://support.epson.biz/td/api/doc_check.php?dl=brief_fa-238v_en.pdf, hand-soldering, 3.2x2.5mm^2 package SMD Resomator/Filter Murata TPSKA, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, hand-soldering, 6.9x2.9mm^2 package SMD Crystal TXC 7M http://www.txccrystal.com/images/pdf/7m-accuracy.pdf, hand-soldering, 3.2x2.5mm^2 package SMD Crystal Seiko Epson MC-156 https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-156_en.pdf, 7.1x2.5mm^2 package SMD Crystal MicroCrystal CC8V-T1A/CM8V-T1A series http://www.microcrystal.com/images/_Product-Documentation/01_TF_ceramic_Packages/01_Datasheet/CC8V-T1A.pdf, hand-soldering, 2.0x1.2mm^2 package SMD Crystal EuroQuartz MQ series http://cdn-reichelt.de/documents/datenblatt/B400/MQ.pdf, 7.0x5.0mm^2 package SMD SMT ceramic resonator filter CSTLSxxxX Ceramic Resomator/Filter 6.0x3.0mm^2, length*width=6.0x3.0mm^2 package, package length=6.0mm, package width=3.0mm, 3 pins UFQFPN 20-lead, 3 x switching (normalling) stereo jack (T/R/S), https://www.neutrik.com/en/product/nj3fd-v 6.35mm (1/4 in) Vertical Jack, 3 x 3 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package (http://www.st.com/resource/en/datasheet/stm8s003f3.pdf ST UQFN 6 pin 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN 0.5 ST 20-Lead Plastic Quad Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 24 pin, exposed pad: 4.5x8.1mm, with thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size.

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