3
1
Back

SPST Copal_CVS-01xB, Slide, row spacing 7.62 mm (300 mils), LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 8-Lead, 300\" Wide, Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89006xx, 6 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator ipc_noLead_generator.py DE Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf 20-Lead Plastic Thin Shrink Small Outline (SN) - Narrow, 3.90 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00479-02.pdf), generated with kicad-footprint-generator Hirose series connector, B03P-NV (http://www.jst-mfg.com/product/pdf/eng/eNV.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/pca9548a.pdf#page=37), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 105313-xx02, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 10, Wuerth electronics 97730606332 (https://katalog.we-online.com/em/datasheet/97730606332.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M2, height 4, Wuerth electronics 9774015943 (https://katalog.we-online.de/em/datasheet/9774015943.pdf), generated with kicad-footprint-generator connector Molex Sabre Power Connector, 43160-2106, With thermal vias in pads, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=39), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 53048-1010, 10 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole Mallory low-profile piezo buzzer, https://mspindy.com/spec-sheets/AST1109MLTRQ.pdf 5.5V, 470mF supercapacitor, 45mohm, -40ºC to +70ºC, https://www.cap-xx.com/wp-content/uploads/datasheets/CAP-XX-DMF470mF-Datasheet.pdf Cliff single 4mm shrouded banana panel socket, through-hole, row spacing 6.73 mm (264 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 2x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 10.8x21.88mm 8x-dip-switch SPST KingTek_DSHP08TJ, Slide, row spacing 7.62 mm (300 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile DIP Switch SPST Slide 7.62mm 300mil SMD 2x-dip-switch SPST Omron_A6S-210x, Slide, row spacing 8.89 mm (350 mils), body size 9.78x22.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 4x-dip-switch SPST Copal_CHS-04A, Slide, row spacing 7.62 mm (300 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 4x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils), SMDSocket, SmallPads 20-lead though-hole mounted DIP package, row spacing 11.43 mm.

New Pull Request