Labels Milestones
Back0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A BGA 324 0.8 CSGA324 Artix-7, Kintex-7.
- Wafer level chip-size package; 15 bumps (6-3-6.
- 0.485556 -0.815507 vertex 1.60745 2.41466 18.8956 facet.
- Code formatting; added a few comics.
- 9.890134e+01 1.855000e+01 facet normal.
- -0.109219 0.0703592 facet normal -0.061906 0.0779143 0.995036 facet.