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Back100644 Schematics/SynthMages.pretty/PinSocket_1x03_P2.54mm_Vertical.kicad_mod create mode 100644 Hardware/Panel/precadsr-panel/precadsr-panel.pro create mode 100644 Docs/precadsr_bom.md create mode 100644 Schematics/Luthers_Perfboard.pdf From dd8c61c34faaeb27b8a193b7a0410df7bb5b6b87 Mon Sep 17 00:00:00 2001 Subject: [PATCH 08/13] More notes C10, C14 too small for a single 2 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 3.5mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 2.5 mm² wires, basic insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose DF13 through hole, DF13-04P-1.25DS, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41792-0009 example for new mpn: 39-30-0200, 10 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated.
- Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf USON-10.
- Vias (https://ww2.minicircuits.com/pcb/98-pl012.pdf Mini-Circuits top-hat case DB1627.