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4.36x4.07mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf 3x3mm Body, 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN 0.5 Qorvo 2x2mm DFN package size 62x19.5x14mm, https://silvertel.com/images/datasheets/Ag5400-datasheet-high%20Efficiency-30W-Power-Over-Ethernet-Plus-Module-PoE+PD.pdf DCDC-Converter Silvertel Ag5405 Ag5412 Ag5424 single output POE DCDC-Converter, 60W POE, Silvertel, pitch 2.54mm, size 30.9x6.2mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_310671_RT019xxHDWC_OFF-023605N.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block Phoenix PT-1,5-13-3.5-H, 13 pins, pitch 5mm, size 65x9mm^2, drill diamater 1.2mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block WAGO 236-108, 45Degree (cable under 45degree), 3 pins, pitch 2.54mm, package size 69.98x30x15.64mm, https://silvertel.com/images/datasheets/Ag5810-datasheet-IEEE802_3bt-Power-over-Ethernet-4-pair-PD.pdf DCDC-Converter Silvertel Ag5810 single output DC/DC, http://power.murata.com/data/power/ncl/kdc_cre1.pdf Isolated 1W DCDC-Converter, http://power.murata.com/data/power/ncl/kdc_nma.pdf Murata NMAxxxxSC footprint based on EPCOS app note at http://www.cypress.com/file/140006/download DFN, 6 Pin (https://www.ti.com/lit/ds/symlink/sn74auc1g04.pdf#page=24), Solder Mask Defined VSON, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15), generated with kicad-footprint-generator JST SH series connector, S10B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Mounting Hardware, external M3, height 15, Wuerth electronics 9774035243 (https://katalog.we-online.de/em/datasheet/9774035243.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Lead Frame Chip Scale Package - 3x3 mm Body [QFN] with thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf TDFN, 6 Pin (https://www.diodes.com/assets/Package-Files/U-DFN2020-6%20(Type%20C).pdf), generated with kicad-footprint-generator Molex SlimStack side entry JST SUR series connector, B18B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.1 mm² wire, basic insulation, conductor diameter 0.48mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Panelmate series connector, SM09B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-143-02-xxx-DV-A, 43 Pins per row.

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