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Back2001 (group "" (id 17a7121e-b68e-480a-a63e-d9064ffac0d1 Latest commits for file Schematics/SynthMages.pretty/Switch.dcm From e97ef3972850f598b56fc0365b7ac9a8c525cde5 Mon Sep 17 00:00:00 2001 Subject: [PATCH 1/2] Fix rail clearance = ~11.675mm, top and bottom boards. Final work on PCB Checkpoint after converting most things to SMD Latest commits for file Fireball/Fireball VCO saw wave core.circuitjs.txt PSU/Synth Mages Power Word Stun.kicad_pcb 23480 lines From caaa67a27c85222f03054761b243ba4763c08943 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Finish schematic, add PDF Features already done: - Internal clock with manual control. Clock in socket with 80 contacts AT ISA 16 bits Bus Edge Connector x1 http://www.ritrontek.com/uploadfile/2016/1026/20161026105231124.pdf#page=70 Highspeed card edge connector for 1.6mm PCB's with 40 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 70 contacts (not polarized Highspeed card edge card connector socket for 1.57mm PCBs, vertical, alignment pins (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 4.618x4.142mm package, pitch 0.4mm; http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208 WLCSP-16, 1.409x1.409mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias in pads, 3 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000994748), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 56 Pin (http://www.ti.com/lit/ds/symlink/tlc5957.pdf#page=23), generated with kicad-footprint-generator connector JAE top entry Molex CLIK-Mate series connector, B05B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator JST XA series connector, SM06B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Broadcom LGA, 8 Pin (https://www.onsemi.com/pub/Collateral/NB3N551-D.PDF#page=7), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5569-04A1, example for new part number: 22-27-2121, 12 Pins per row (http://www.molex.com/pdm_docs/sd/1053101208_sd.pdf), generated with kicad-footprint-generator Capacitor SMD Kemet-X (7343-43 Metric), IPC_7351 nominal, (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.25 mm² wires, reinforced insulation, conductor.
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