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Back*.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969.
- Http://www.ti.com/lit/ml/mpds158c/mpds158c.pdf VSO40: plastic very small.
- 1.110874e+01 vertex -1.052281e+02 9.725134e+01 1.106430e+01 facet normal.