Labels Milestones
BackZynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 461, 4.63x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x12 5.08mm single row Surface mounted pin header THT 2x13 2.54mm double row Through hole pin header SMD 1x14 2.54mm single row style1 pin1 left Surface mounted socket strip THT 2x25 2.54mm double row Through hole IDC header, 2x06, 1.27mm pitch, double rows Through hole straight socket strip, 2x40, 2.00mm pitch, 6.35mm socket length, single row.
- Strip, HLE-133-02-xx-DV-TE, 33 Pins.
- 8.963632e+00 vertex -1.080268e+02 9.665134e+01 8.942076e+00 facet.
- -0.114971 -8.78678e-05 0.993369 facet normal.
- -9.052261e+01 1.005513e+02 1.055902e+01 vertex -9.053832e+01.