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.../UNSEEN SERVANT.png | Bin 0 -> 149061 bytes Images/IMG_6770.JPG | Bin 0 -> 12821 bytes .../COLOR SPRAY.png | Bin 0 -> 36336 bytes create mode 100644 Hardware/Panel/precadsr_panel_al/precadsr_panel_al.pretty/precadsr-panel-holes.kicad_mod delete mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/DIP-14_W7.62mm_Socket_LongPads.kicad_mod create mode 100644 3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/Panels/PRISMATIC SPHERE.png' 9bb3093b2b Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/HOLD PORTAL.png differ Binary files /dev/null and b/Panels/FireballSpell_Large_bw.xcf differ From d74befe391233bd8b162f7f5705c277e04d9b135 Mon Sep 17 00:00:00 2001 Subject: [PATCH] gets jiggy with PCB locator, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.423x2.325mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 3.623x3.651mm package, pitch 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small.

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