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Proximity, Ambient Light, RGB and Gesture Sensor (https://docs.broadcom.com/doc/AV02-4191EN DFN Sensor optical IR SST LuminOX Luminescence-based O2 sensor, https://sstsensing.com/wp-content/uploads/2021/08/DS0030rev15_LuminOx.pdf Gas Sensor, 6 pin, https://www.winsen-sensor.com/d/files/semiconductor/mq-6.pdf Sensair S8 Series CO2 sensor, 1kHz PWM output, Modbus, THT co2 gas sensor pwm modbus Sensirion SCD4x QFN, 20 Pin (JEDEC MO-153 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.7mm, height 8, Wuerth electronics 9776050960 (https://katalog.we-online.com/em/datasheet/9776050960.pdf), generated with kicad-footprint-generator JST J2100 series connector, B6B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, S10B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator JST PH series connector, B5B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator connector wire 0.75sqmm strain-relief Soldered wire connection with double feed through strain relief, for 5 times 0.127 mm² wires, reinforced insulation, conductor diameter 0.5mm, outer diameter 1.7mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST GH series connector, 53398-0671 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-36DS-0.5V, 36 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py package for diode bridges, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 14-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 24.13mm 950mil SMDSocket LongPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 5-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 20-lead surface-mounted (SMD) DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads 8-lead though-hole mounted DIP package, row.

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