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WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l072kz.pdf WLCSP-49, 7x7 raster, 3.89x3.74mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32f042k6.pdf WLCSP-36, 6x6 raster, 2.5x2.5mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.8mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small outline http://www.ti.com/lit/ml/mpds158c/mpds158c.pdf VSO40: plastic very small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf HVSSOP, 10 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001725D.pdf (Page 9)), generated with kicad-footprint-generator ipc_gullwing_generator.py 8-Lead Plastic Dual Flat, No Lead Package - 4x4x0.9 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 44 leads; body width 4.4 mm; thermal pad TSSOP HTSSOP 0.65 thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506CM.PDF DFN, 14 Pin (http://www.ti.com/lit/ds/symlink/tlv9004.pdf#page=64), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF (T2044-5C)), generated with kicad-footprint-generator JST ZE series connector, LY20-8P-DT1, 4 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 1.5, Wuerth electronics 9771150360 (https://katalog.we-online.com/em/datasheet/9771150360.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP I, 28 pins, surface mount PLCC, 20 pins, dual row male, vertical entry, with latches, PN:G125-MVX2605L1X Harwin Gecko Connector, 34 pins, dual row female, vertical entry, PN:G125-FVX1005L0X Harwin Gecko Connector, 50 pins, dual row female, vertical entry, strain relief clip Harwin LTek Connector, 17 pins, single row Through hole vertical IDC box header, 2x13, 2.00mm pitch, single row Through hole straight socket strip, 2x22, 2.54mm pitch, single row style2 pin1 right Through hole angled pin header THT 2x01 2.00mm double row surface-mounted straight pin header, 1x25, 2.00mm pitch, 6.35mm socket length, single row style2 pin1 right Through hole angled pin header, 2x36, 1.00mm pitch, single row Through hole pin header SMD 2x03 2.54mm double row surface-mounted straight socket strip, 2x04, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 2x11 2.54mm double row Through hole Samtec HPM power header series 3.81mm post length, 1x04, 5.08mm pitch, single row Through hole straight socket strip, 1x36, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x09 2.54mm single row Through hole straight socket strip, 2x38, 2.00mm pitch, double rows Through hole angled socket strip THT 1x13 2.00mm single row Surface mounted pin header THT 2x21 2.00mm double.

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