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BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch.

• 1.51264 vertex -3.47906 -9.35243 0.0388323.
• Connect Type101_RT01606HBWC, 6 pins, pitch.
• 2.98805 -4.47193 22.0001 vertex -5.27501 1.04926 22.0001 vertex.
• A-41792-0015 example for new.
• 5.481103e+000 1.747200e+001 facet normal 0.528262 0.643692.

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