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Top), 7 pins, pitch 7.5mm, size 45x11mm^2, drill diamater 1.1mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00078_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00080, 4 pins, pitch 10mm, size 32.3x14mm^2, drill diamater 1.3mm, pad diameter 2.5mm, hole diameter 1.0mm test point SMD pad SMD pad rectangle square SMD pads Net tie, 2 pin, 1.0mm round THT pads Laser Gaming Sensor ADNS-9800 Fiberoptic Transmitter TX, HFBR series (https://docs.broadcom.com/docs/AV02-3283EN Fiberoptic Receiver RX, HFBR series (https://docs.broadcom.com/docs/AV02-3283EN Fiberoptic Receiver RX, HFBR series (https://docs.broadcom.com/docs/AV02-3283EN TSL2550 ambient light sensor Fiber Optic Transmitter and Receiver ambient light sensor Fiber Optic Transmitter and Receiver, https://docs.broadcom.com/docs/AV02-4369EN Fiber Optic Transmitter and Receiver, https://docs.broadcom.com/docs/AV02-4369EN Fiber Optic Transmitter and Receiver, https://docs.broadcom.com/docs/AV02-4369EN Fiber Optic Transmitter and Receiver, https://docs.broadcom.com/docs/AV02-4369EN Fiber Optic Transmitter and Receiver, https://docs.broadcom.com/docs/AV02-4369EN Fiber Optic Transmitter and Receiver ambient light sensor chipled Broadcom DFN, 6 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AB), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-113-02-xxx-DV-LC, 13 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Capacitor SMD AVX-H (3528-15 Metric), IPC_7351 nominal, (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-148-02-xxx-DV-BE, 48 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0005 example for new mpn: 39-28-910x, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Capacitor SMD AVX-U (7132-20 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0210, with PCB locator, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 40 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation DC), generated with kicad-footprint-generator.

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