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Wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout.

• Vertex 2.572281e+000 -4.415690e+000 2.480400e+001 facet normal -0.768509 0.630625.
• 0.485049 -0.124364 0.865599 vertex.
• Round part of the NOTICE.
• 2.5787305,8.8582674 h -0.19685" d="m 3.4251927,4.4291344 v 0.196852" d="m.
• 804-124 45Degree pitch 5mm.

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