synth_tools

Back

UFBGA-32, 6x6, 4x4mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-49, 7x7 raster, 3.277x3.109mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00340475.pdf WLCSP-66, 9x9 raster, 4.039x3.951mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f100v8.pdf TFBGA-100, 10x10 raster, 4.201x4.663mm package, pitch 0.4mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00282249.pdf WLCSP-90, 10x9 raster, 4.223x3.969mm package, pitch 0.4mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf 44-Lead Plastic Quad Flat, No Lead Package - 4.0x4.0x0.8 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 10-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket THT DIP DIL PDIP 2.54mm 15.24mm 600mil 24-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 12x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket 42-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 10.8x14.26mm 5x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils), Clearance8mm 12-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 10.8x21.88mm 8x-dip-switch SPST KingTek_DSHP08TS, Slide, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 3M 24-pin zero insertion force socket, through-hole, row spacing 25.4 mm (1000 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 32-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 16.51mm 650mil SMDSocket LongPads 64-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x4.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 9x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), LongPads 28-lead though-hole mounted DIP package, row spacing.

New Pull Request

Labels Milestones