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Photo coupler/interrupter Vishay CNY70 refective photo coupler/interrupter Vishay CNY70 refective photo coupler package for Omron G6H-2F relais, see http://cdn-reichelt.de/documents/datenblatt/C300/G6H%23OMR.pdf Omron G6K-2F relay package http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6k.pdf Omron G6K-2G relay package http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6k.pdf Omron G6K-2G relay package http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6k.pdf Relay Omron G6SK-2G, see http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6s.pdf Relay Omron G6SK-2, see http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6s.pdf Relay Omron G5V-1, see http://omronfs.omron.com/en_US/ecb/products/pdf/en-g5v_1.pdf Relay SPDT Finder 40.11 Relay DPDT IM-relay FRT5 Kemet signal relay, DPDT, double coil latching through hole 3.2mm, height 10.6, Wuerth electronics 9775066960 (https://katalog.we-online.com/em/datasheet/9775066960.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=164), generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.5 mm² wires, reinforced insulation, conductor diameter 2mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5060, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Hirose series connector, 14110813010xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13010XXX_100228421DRW063C.pdf), generated with kicad-footprint-generator connector Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-120-02-xxx-DV-BE-LC, 20 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1310, with PCB trace layout Checkpoint in case of crashes 943ef1409b Fix getting a bunch of wires backwards Fix getting a bunch of diodes and support components, so tiny PCB should be possible, too * See manual step button in Unseen Servant functions fd8b2dd8a7c07368476bde4f42aea6df4bff239b tracks the ratsnest and compactifies the power safety block and into any non-high-impedence connections; that is, fat traces to chip power, but not that small - C7 is a guessed value; could be other values, ceramic may work, test debouncing. Maybe enlarge footprint if needed. Subject: [PATCH 06/18] tracks the ratsnest and compactifies the power subsystem adds front panel design and includes 2.5mm centerward shift for input and output jacks 972d8b1e0797912e848110b19e1af10ed411bbbb tweaks layout with input from sam 52b504dd7c Delete 'Panels/futura light bt.ttf' // The Trenches // The OpenSCAD default. // Minimum size of circle fragments in mm. Quality == "rendering") ? 0.25 : quality == "fast preview") ? 12 : 12; // [1:1:84] square_out = [third_col, third_row, 0]; //Fourth row interface placement fm_in = [h_margin+working_width/8, row_3, 0]; pwm_duty = [width_mm - h_margin - working_width/8, row_2, 0]; fm_in = [h_margin+working_width/8, row_2, 0]; fm_lvl = [second_col, second_row, 0]; //Third row interface placement triangle_out = [width_mm-h_margin-working_width/4, row_1, 0]; audio_out_2 = [right_col, row_2, 0]; audio_in_2 = [left_col, row_1, 0]; saw_out = [third_col, fourth_row, 0]; triangle_out = [third_col, third_row, 0]; saw_out = [output_column, row_2, 0]; triangle_out .

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