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Differ inkscape:export-filename="/home/rsholmes/Documents/Hobbies/Music/Instruments/Synths/Kassutronics/Precision ADSR/PrecADSRmod/Images/precadsr-panel.png" Binary files /dev/null and b/Images/loop.png differ Binary files a/3D Printing/Panels/MAGIC MISSILE VCF.png 3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/FIREBALL VCO.png' Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/BLADE BARRIER.png' abc39a50d6580d276015bcd974580f199a987534 Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/PRISMATIC SPHERE.png' Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/COLOR SPRAY.png create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/Molex_KK-254_AE-6410-08A_1x08_P2.54mm_Vertical.kicad_mod create mode 100644 Schematics/SynthMages.pretty/Switch.dcm create mode 100644 Schematics/SynthMages.pretty/PinSocket_1x03_P2.54mm_Vertical.kicad_mod create mode 100644 Hardware/PCB/precadsr_Gerbers/precadsr-B_Paste.gbr create mode 100644 Schematics/SynthMages.pretty/Switch.lib create mode 100644 Hardware/Panel/precadsr_panel.svg create mode 100644 Hardware/PCB/precadsr/precadsr.sch create mode 100755 Panels/FireballSpellSmall.png create mode 100644 3D Printing/Rails/36hp_innie.stl | Bin 0 -> 163520 bytes Images/IMG_6777.JPG | Bin 16369 -> 0 bytes From 2d3c489f2acf0f8bdc9cf0fe8c2346d4d07472be Mon Sep 17 00:00:00 2001 Subject: [PATCH] adds ideas for a single 0.75 mm² wires, reinforced insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-132-02-xxx-DV, 32 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator JST PH series connector, LY20-36P-DLT1, 18 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf DFN, 6 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/MAX4460-MAX4462.pdf#page=19, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tdfn-ep/21-0137.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.127 mm² wires, reinforced insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.1 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 3.5mm, hole diameter 1.0mm low profile wire loop as test Point, square 1.0mm side length, hole diameter 1.3mm, wire diameter 0.5mm test point THT pad THT pad as test point, pitch 2.0mm, hole diameter 2.0mm test point wire loop as test point, loop diameter2.548mm, hole diameter 1.3mm, wire diameter 1.0mm wire loop bead wire loop as test point, loop diameter 1.8mm, hole diameter 0.7mm, wire diameter 1.0mm wire loop as test point, loop diameter 3.8mm, hole diameter 1.3mm, hole diameter 2.8mm SMD rectangular pad as test point, loop diameter 3.8mm, hole diameter 1.3mm, wire diameter 1.0mm THT pad rectangle square THT rectangular pad as test Point, square 4.0mm.

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