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2.54mm 9.53mm 375mil 4-lead surface-mounted (SMD) DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 22-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket 64-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils.

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