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BackSimulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes count 16 Not plated through holes are merged with plated holes count 16 ============================================================= Total unplated holes count 16 Not plated through holes are merged with plated holes count 0 Minor layout tweaks Minor layout tweaks Minor layout tweaks Minor layout tweaks Finish schematic, add.
- 0 -8.07502 5.88782 facet normal -0.551953.
- Header, 1x02, 1.27mm pitch.
- Https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die.
- 45x8.1mm^2, drill diamater 1.2mm, pad diameter 2.5mm.