Labels Milestones
BackSmall outline package; 28 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 16 leads; body width 4.4 mm; thermal pad 3x2mm Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3.
- 2x40 1.27mm double row Through hole.
- -0.288901 0.0975479 facet normal 0.0819801 0.0822463 0.993235 vertex.
- 9.337724e+01 4.255000e+01 facet normal -0.757662 0.648843 -0.0703627.
- N N 1 F.
- SM13B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC.